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    Advanced Packaging Inspection at SEMICON Taiwan 2023

    TRI 4

    Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join SEMICON Taiwan held at Taipei Nangang Exhibition Center, Hall 1 – 1F from September 6 – 8, 2023. Visit booth #I2800 to experience the latest in Smart Factory Semiconductor Inspection.

    TRI’s AI-powered AOI solutions for the Semiconductor and Advanced Packaging Industry can inspect Die and Wire Bonding, wafer surface and bumps, epoxy, and foreign material detection.

    For the first time, TRI will be exhibiting the Wafer Inspection Platform, TR7950Q SII, equipped with a state-of-the-art mechanical structure, an optimal 2.5 µm high resolution, with an outstanding 25MP camera. The TR7950Q SII is equipped with an innovative optical module for the inspection of highly reflective surfaces, specialized for Wafer Inspection.

    TRI will showcase the latest 3D SPI with a 3.5 µm high-resolution 25MP Camera, TR7007Q SII, and the AI-powered 3D AOI, TR7700Q SII, with the improved 25MP 2.5 µm configuration. The TR7007Q SII and the TR7700Q SII represent TRI’s latest inspection innovations for the Advanced Packaging and Semiconductor Industry. The lineup will also include an X-ray Inspection Demo Station and TRI’s innovative AI Solutions, which include the AI Station, AI Training Tool, and the AI Verify Host.

    Visit TRI’s Booth No. I2800 at SEMICON Taiwan 2023 to learn more about TRI’s SEMI applications and the latest innovations in Test and Inspection for the Advanced Packaging Industry.