AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce the release of its new low-voiding, no clean solder paste, V9.
Formulated to solve one of the industry’s most difficult challenges, studies have proven V9 to reduce voiding to as low as 1% on BGA and <5% on BTC components while exhibiting stable print performance on fine feature devices over 12 hours. V9 post-process residue is easily probed and possesses the high SIR values required for high reliability applications.
Both REACH and RoHS compliant, AIM’s V9 Low-Voiding No Clean Solder Paste is available in SAC305 T4.
“Our studies show that solder joint reliability and thermal dissipation concerns are significantly reduced with V9,” said Timothy O’Neill, AIM’s Director of Product Management. “V9 is proven to improve production yields and product quality, whether printing 0.50 area ratios or eliminating voiding on BGA and BTC packages.”