AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce their participation in the upcoming NEPCON Asia and SMTA South China taking place from November 30th – December 2nd in Shenzhen. AIM will highlight their MiniLED assembly and new AIM LUX™ Product Line, along with their full line of solder assembly materials.
During SMTA South China on November 30th, AIM Solder’s Flopy Feng will present from 13:45-14:20 on the concerns of Ultra-Miniature Component Assembly, covering M0201, 008005 and Micro/MiniLEDs in Hall 5 in the Shenzhen World Exhibition & Convention Center. AIM’s presentation will detail the challenges in producing MiniLED assemblies and provide information about how AIM products are being used to address the unique requirements of current and future applications.
Designed to provide tier one manufacturers of LED, miniLED and hi-power LED assemblies with solder materials to solve production challenges associated with these applications, the LUX product line pairs ultra-fine SAC-based and silver-free Type 6, 7 and 8 alloy powders along with innovative flux chemistries. AIM’s NC259 series is proven to provide excellent soldering performance and high production yields. When combined with the SN100C® alloy, NC259 solder pastes eliminate silver migration concerns. AIM REL61™ is a low-silver alloy option that can lower peak reflow temperature requirements and improve mechanical strength over other low/no-silver alloys. For high-power LEDs, AIM’s REL22™ doubles the service life under extreme thermal cycling conditions. AIM’s Tacky Flux offers high tack forces, unlimited
open time, and improved wetting for all mass transfer and high-speed dipping applications.
To discover all of AIM’s products and services, visit the company at the NEPCON Asia and SMTA South China from November 30th – December 2nd for more information and to speak with one of AIM’s knowledgeable staff members, or visit www.aimsolder.com.