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    Alpha’s Jason Fullerton to Present at Upcoming SMTA Michigan Chapter Technical Session


    Alpha Assembly Solutions is participating in the upcoming SMTA Michigan Chapter on September 12 as a technical presenter.

    A presentation on “The Discrepancy Between Ionic Contamination and SIR Testing in Predicting Electrical Reliability” will be given by Jason Fullerton, Customer Technical Support Engineer for Alpha Assembly Solutions, a part of the MacDermid Performance Solutions group of businesses.  Among the topics covered, Fullerton will compare the results from testing two solder pastes using the IPC-J-STD-004B IPC TM-650 surface insulation resistance test, and IPC TM-650 2.3.25 in an attempt to investigate the correlation of ROSE methods as predictors of electronic assembly electrical reliability.

    “Many users of no-clean solder pastes treat ROSE (Resistance of Solvent Extract) testing as suitable to ascertain whether or not flux residues will be detrimental to the long-term reliability of printed circuit assemblies,” said Jason Fullerton. “However, when compared to SIR (Surface Insulation Resistance) testing, the results of ROSE tests can be shown to provide different results than SIR on the same materials.”

    The technical session will be following by a golf outing, both to be held at the Oak Pointe Country Club in Brighton, Michigan. Registration for both the technical presentations and golf outing is free, courtesy of the Michigan SMTA.

    Additional information:

    SMTA Michigan Chapter Technical Session & Golf Outing

    September 12, 2016

    Oak Pointe Country Club

    4500 Club Dr. Brighton, MI 48116

    9:30AM – Registration

    10:00 AM – Technical Meeting in Clubhouse

    12:00PM – Shotgun start

    The Discrepancy Between Ionic Contamination and SIR Testing in Predicting Electrical Reliability

    Presented by: Jason Fullerton – ALPHA ASSEMBLY SOLUTIONS

    Speaker Biography – Jason Fullerton

    Jason has over 20 years of experience in manufacturing operations in the automotive, high-reliability, and commercial electronics industries, specializing in SMT and wave soldering processes. He has also worked at a failure analysis lab and IPC Training Center near his hometown of Philadelphia. He earned his Bachelor’s Degree in Manufacturing Engineering from GMI Engineering & Management Institute (now Kettering University) in Flint, MI.  Additionally, Jason is an ASQ Certified Quality Engineer, Six Sigma Black Belt, and Reliability Engineer and has published and presented at a number of IPC and SMTA meetings.

    About SMTA

    The Surface Mount Technology Association (SMTA) is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

    About Alpha Assembly Solutions

    Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.

    With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA® electronics assembly material products, including Solder Paste, Exactalloy® Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils.  It offers die attach product technologies to the power electronics segment in its Argomax®, Atrox™ and Fortibond™ brands.

    For the LED segment, Alpha offers its Lumet™ products covering applications from die attach to systems assembly in the LED manufacturing process.  Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications.

    Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials.  For more information, click here.