Amkor Technology has agreed to acquire Nanium, a provider of wafer-level fan-out (WLFO) semiconductor packaging services. Financial terms of the transaction have not been disclosed. The acquisition of Nanium is expected to strengthen Amkor’s position in the market of wafer-level packaging for smartphones, tablets and other applications.
Nanium reports it has shipped nearly one billion WLFO packages to date using a 300mm Wafer-Level Packaging (WLP) production line. Portugal-based Nanium currently has around 550 employees and reported annual sales of USD 40 million for its fiscal year ended 30 September 2016.
The transaction is expected to close in the first quarter of this year, subject to customary closing conditions and regulatory approvals.