Saving Semiconductor Fabs Significant Time, Expense and Improving Yields
Minneapolis, MN— August 13, 2018 — CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high precision 3D sensing technology solutions, announces it will demonstrate its ReticleSense® Auto Multi Sensors™ (AMSR) – the world’s most efficient and effective wireless measurement devices for semiconductor fabs and equipment OEMs at the SPIE PhotoMask Technology and EUV Lithography conference, September 17-20 at the Monterey Conference Center in California in booth #104.
ReticleSense Auto Multi Sensors (AMSR) measure leveling, vibration, and relative humidity (RH) in an all-in-one wireless real- time device. The AMSR speeds equipment qualification, shortens equipment maintenance cycles and lowers equipment maintenance expenses. Multiple measurements can be captured and monitored in all locations of the reticle environment, saving equipment engineers or process engineers’ time and expense.
CyberOptics will also demonstrate the ReticleSense Airborne Particle Sensor (APSRQ) that speeds equipment set-up and long-term yields in semiconductor fabs by wirelessly monitoring airborne particles in real-time. Engineers can save time by swiftly locating contamination sources and see the effect of cleanings, adjustments and repairs.
CyberOptics Corporation (www.cyberoptics.com) is a leading global developer and manufacturer of high precision sensing technology solutions. CyberOptics’ sensors are used in SMT, semiconductor and metrology markets to significantly improve yields and productivity. By leveraging its leading edge technologies, the company has strategically established itself as a global leader in high precision 3D sensors, allowing CyberOptics to further increase its penetration of key vertical markets. Headquartered in Minneapolis, Minnesota, CyberOptics conducts worldwide operations through its facilities in North America, Asia and Europe.
Statements regarding the company’s anticipated performance are forward-looking and therefore involve risks and uncertainties, including but not limited to: market conditions in the global SMT and semiconductor capital equipment industries; the timing of orders and shipments of our products, particularly our 3D MRS-enabled AOI systems; increasing price competition and price pressure on our product sales, particularly our SMT systems; the level of orders from our OEM customers; the availability
of parts required to meet customer orders; unanticipated product development challenges; the effect of world events on our sales, the majority of which are from foreign customers; rapid changes in technology in the electronics markets; product introductions and pricing by our competitors; the success of our 3D technology initiatives; the market acceptance of our SQ3000 3D CMM system, mid-end semiconductor inspection sensors and CyberGage360 product; costly and time consuming litigation with third parties related to intellectual property infringement; and other factors set forth in the company’s filings with the Securities and Exchange Commission.
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