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    Indium Corporation to Present Power Module Poster at PCIM Asia


    Indium Corporation’s Leo Hu, senior area technical manager – East China, will share insights on tool-free solder preform technology for power module assembly during a poster session at PCIM Asia, Sept. 9-11, Shenzhen, China.

    In power module manufacturing, emerging performance demands and their impact on module design present reliability challenges, such as increased junction temperatures, current densities, and packaging complexity. Manufacturers are adopting key techniques to achieve reliability, by precisely aligning component distance and tolerance between dies, using high-quality reflow techniques, and avoiding the use of additional flux. Dedicated fixturing systems are being used to maintain alignment during assembly and reflow, but challenges are driving timeline and cost. Based on a presentation developed by Indium Corporation’s Product Manager – ESM/Power Electronics Joe Hertline, Global Account Manager and Senior Thermal Technologist Tim Jensen, and Regional Technical Manager and Technologist – Advanced Applications Andreas Karch, and Bond Pulse’s Dr. Aaron Hutzler, the poster Reducing Design-for-Manufacturing Complexity with Tool-Free Solder Preform Technology for Power Module Assembly will review these challenges and a solution—a novel tacking material technology that enables precise placement without dedicated tooling and fixturing equipment. This material offers robust tackiness, precise and repeatable alignment, and prevents uneven stress distribution and thermal hot spots.

    Hu joined Indium Corporation in 2016 and is based in Suzhou, China. He has nearly 15 years of experience in semiconductor packaging and is a veteran in advanced assembly technology development, process improvement, and assembly materials applications. Hu has served in many roles at industry-leading outsourced assembly and test (OSAT) companies, including process engineer, project engineer, senior R&D engineer, and chief engineer. He has a master’s degree in IC engineering from the Chinese Academy of Science and a bachelor’s degree in electronic information science and technology from Nankai University, Tianjin, China.