Indium Corporation Senior Area Technical Manager Jason Chou will present at SEMICON Taiwan on September 7, in Taipei, Taiwan.
In his presentation, The Lead-Free Materials Evolution in Power Die-Attach Soldering Applications, Chou will provide an overview of the die-attach process and explore the ongoing evolution of materials used in the application including high-Pb, low-alpha solder paste, high- temperature, Pb-free paste, and sintering products.
As senior area technical manager in Taiwan, Chou provides technical support to customers with a focus on the semiconductor industry. He has 10 years of industry experience, including specialization in front-end wafer fabrication processes, thin-film modules, and defect analysis for wafer metrology. Chou earned a master’s degree in Chemistry from National Tsing Hua University and a bachelor’s degree in Chemistry from National Cheng Kung University. He served as the group leader for the National Nano Device Laboratory, Tainan, Taiwan, where he collaborated with university professors and industry professionals on special projects for semiconductor manufacturing.