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    IPC Southeast Asia High Reliability Conferences 2018


    IPC Southeast Asia High Reliability Conferences 2018
    HCM City, Vietnam – 1 August | Bangkok, Thailand – 3 August
    Singapore – 5 September | Penang, Malaysia – 1 November

    Get practical methodologies that can be deployed today to enhance your operations

    High Reliability is critical when electronics assemblies are working in harsh environments where there are high temperature difference, vibration.

    These important one-day events will focus on advanced research results, practical methodologies and standards in the automotive, aerospace and other electronic fields — critical information for engineers and managers responsible for reliability.

    Present your work and make an impact at this important event that will take participants through the assembly process — from materials to test and inspection — and provide the latest information to increase reliability.

    As a speaker, you will be promoted as an industry expert in IPC communications distributed to a global audience and event participants. This is a unique and cost-effective channel for promoting your organization’s capabilities and an opportunity to make a contribution to the industry.

    Topics of interest include:

    • Adhesives and Underfill
    • Cable and Wire Harness
    • Cleaning and Conformal Coating
    • Design for ESD, Manufacturing, Reliability and Test
    • Electronics Packaging, Components and RF
    • Environmental Compliance/Regulations
    • Interconnections on PCB
    • Lead-free Assembly
    • Materials and Processing
    • Solder Alloys
    • Yield and Quality Control in Manufacturing

    Requirements for Submission

    Your submission must be received two months before the event starts:

    • An abstract of 200 to 300 words that summarizes recent technical work — case histories, research and discoveries
    • Your professional biography
    • Complete contact information

    Your presentation should be non-commercial in nature and describe significant results from experiments, emphasize new techniques, discuss trends of interest or contain technical and/or appropriate test results. Suggested time for presentations is 45 minutes.

    How to Submit

    To submit your proposal for a conference presentation, or to learn about conference participation, please contact Raymond Foo at [email protected]

    Sponsorship Information

    *Sponsorship fee per event:

    Gold Sponsor
    US$1,600 IPC Member/US$2,000 Nonmember

    • Speaking Opportunity
      • One technical conference session to share your solutions, best practices and case studies
      • Exhibit Space
      • Conference Marketing
      • Logo on all printed materials and agenda on-site
      • Logo on all electronic promotional material
      • Logo on conference website
      • List of Conference Attendees

    Supporting Sponsor
    US$400 IPC Member / US$500 Nonmember

    • Pre-Conference Marketing
      • Logo on all printed materials and agenda on-site
      • Logo on al l electronic promotional material
      • Logo on conference website
      • List of Conference Attendees

    *20% discount for sponsorship of all four events

    Conference Participation

    • Lunch and two coffee breaks will be provided to all registered participants
      • Complimentary event proceedings and conference kit.
      • Opportunity for networking among the leading technology experts.

    Contact us for more information: 

    S.E. Asia Representative Office
    IPC — Association Connecting Electronics Industries©

    Raymond Foo, [email protected]; Henry Ton, [email protected].