MacDermid Alpha Electronics Solutions, a world leader in the production of innovative materials used in semiconductor, circuitry, and electronics assembly announces the release of ALPHA HRL3 Solder Sphere, a lead-free, high reliability, low temperature alloy for ball mount applications.
ALPHA HRL3 is a lead-free, low temperature, high reliability alloy for use application where low
temperature processing is desired. ALPHA HRL3 is available in solder sphere format for ball mount
application. The alloy was designed to exhibit improved drop shock and thermal cycling performance
versus existing low temperature alloys in the market. The ALPHA HRL3 Solder Spheres offer a wide
operating window, cost savings through low temperature materials and heating energy, while reducing
warpage.
ALPHA HRL3 Solder Spheres is a high-quality lead-free alloy that is capable of soldering at a
temperature lower than standard tin silver copper alloys. ALPHA HRL3 solder alloy is able to demonstrate
reliability performance comparable to standard tin silver copper alloys (SAC305). To ensure consistent
sphere size, uniformity, and alloy content, ALPHA Solder Spheres are manufactured to the highest quality
control standards.
For more information on ALPHA HRL3 Solder Sphere please visit www.MacDermidAlpha.com