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    MacDermid Alpha Showcases Full Spectrum of Electrolube Solution at Productronica South China


    MacDermid Alpha Electronics Solutions, the leading global supplier of integrated circuit, assembly and
    semiconductor solutions for the electronics design and manufacturing industries, will be highlighting their
    unrivalled capabilities as a total process solutions provider at this year’s Productronica South China,
    which takes place at the Shenzhen World Exhibition and Convention Center, 15-17 November 2022, on
    the MacDermid Alpha Stand E17 in Hall 11.

    MacDermid Alpha encompasses a full spectrum of industry leading innovative technologies from Alpha,
    Compugraphics, Electrolube, Kester and MacDermid Enthone brands, giving manufacturers a distinct
    advantage in sourcing all their application-specific needs in one place. MacDermid Alpha has been taking
    a proactive response where innovation is concerned and identifying key areas in the market, rather than
    a passive reactive approach. Essentially, MacDermid Alpha, supplies solutions across all aspects of the
    assembly process from PCB manufacturing, PCB assembly and even reclaim and recycling services.

    MacDermid Alpha will showcase its’ latest new low temperature solder material. Designed to mitigate
    warpage induced defects in temperature sensitive chip-scale packages, the ALPHA OM-565 HRL3 solder
    paste enhances electrochemical performance over existing low temperature solders and provides
    excellent compatibility when used in combination with other ALPHA solutions for contact rework applications . ALPHA OM-565 HRL3 enables superior wettability to minimize post reflow defects such as
    Non-Wet-Open (NWO) and Head-in-Pillow (HIP). Next generation devices require a larger footprint and
    thinner form factor design that deliver superior processing power over existing technologies. These next
    generation packages create challenges for assembly at traditional SMT reflow temperatures. ALPHA OM-
    565 HRL3 enables a reduction in peak reflow down to 175 °C to mitigate common warpage induced
    defects such as HiP and NWO to improve assembly yields.

    Electrolube, the most recent addition to the MacDermid Alpha family of brands is a specialist
    manufacturer for the electro-chemicals industry. The brand has amassed a wealth of local knowledge and
    experience pertaining to China’s domestic market since opening facilities in China twenty years ago. The
    acquisition has proven successful for both MacDermid Alpha and Electrolube, the latter benefitting from
    an expansion of their Chinese Technical Support team. The brand has also recently launched a new
    generation of bio-based conformal coatings and encapsulation resins. Electrolube’s new bio-based
    products build upon their already strong portfolio of solutions. Not only do these new products offer
    environmental benefits but they also provide high performance protection and increase reliability.

    Featured at the show will be a new bio-based polyurethane resins, UR5645, is a tough, two-part
    encapsulation system ideal for a wide range of applications including automotive and marine. UR5645 is a
    highly versatile resin with an operating temperature range of -50 to +150oC and is a low viscosity resin
    that enables a faster and more efficient potting process. It also provides excellent chemical resistance to
    acids, alkalis and fuels, ideally suited for the harshest conditions, such as those found in automotive

    Electrolube additionally offer a wide range of conformal coatings and thermal management materials.
    UVCL is a low viscosity coating with the capacity to cure within seconds of exposure to the correct dosage
    of UV light. UVCL is one of Electrolube’s next generation of VOC-free coatings, and the product’s low
    viscosity ensures that it is eminently suitable for selective spray equipment. The secondary moisture cure
    ensures even shadowed areas can be cured successfully.

    Electrolube’s GF400 is an extremely versatile gap filling material, suitable for a wide variety of
    applications, including e-vehicles and chargers. This two-part silicone-based filling material cures at room
    temperature but the cure can also be accelerated by heat. An impressive thermal conductivity of 4.0
    W/m.K is a feature of this gap filler and following cure, a low modulus elastomer avoids pump out

    MacDermid Alpha’s vast interconnection of specialty electronics solutions ensures that manufacturers
    can access all areas of the electronics supply chain in one place. Visitors to Productronica South China are
    welcome to visit the team on Stand E17 in Hall 11 and talk to our technical experts on their application

    Allen Chen, General Manager China, comments, “We are looking forward to attending the Productronica
    South China show and are excited to showcase our emergence as an advanced group of aligned brands
    offering cutting edge solutions for manufacturers. MacDermid Alpha has gone from strength to strength
    in recent years and we have made significant investments in leadership talent, expanding our
    manufacturing facilities through acquisitions that affiliate well with our existing portfolios and developing
    new product innovations that really meet the demands of our customers. Our investments, expansion
    and international collaboration with leading OEMs have enabled us to firmly position ourselves in the
    market as a reliable and trusted ‘one-stop’ provider at every stage of design and production.”

    MacDermid Alpha Electronics Solutions serves all global regions and all steps of device manufacturing
    within every segment of the electronics supply chain. The experts in our Semiconductor Solutions,
    Circuitry Solutions, and Assembly Solutions divisions collaborate with OEMs and fabricators in the
    implementation of new technologies that redefine what is possible in device design. Our world class
    technical service is constantly at hand to ensure optimized outcomes in yield and productivity. Our
    solutions can increase throughput, reduce carbon footprints, lower total cost of ownership, and enable
    electronics innovation.