- See equipment demonstrations for semiconductor packaging, and talk to Nordson experts in booth E4617
Nordson Electronics Solutions, a global leader in electronics manufacturing technologies, will demonstrate their latest solutions for semiconductor packaging and electronics manufacturing, with partner AMT at the SEMICON China tradeshow, booth E4617. At the booth, you will see these systems:
- The popular ASYMTEK Vantage ® fluid dispensing system, Nordson’s most advanced dispensing platform, is designed for high-end semiconductor packaging and assembly. Fast and accurate, the Vantage, when configured with dual IntelliJet valves, can jet into gaps less than 200 um, and up to 90,000 dots per hour.
- The newest ASYMTEK Forte ® fluid dispensing system offers exceptional dispensing productivity and accuracy for high-volume consumer electronics, flexible circuit, MEMs, and electromechanical assembly applications. Forte offers real-time skew correction (patented) for better wet dispense accuracy and yield, as well as fast, repeatable setup with automated calibration.
- Both systems offer fine-line dispensing capabilities to meet requirements for underfill, gap fill, sealing lines for fan-out/fan-in, strips, and module assembly.
Experts will be ready to discuss how Nordson can support your operations for reliable electronic products. SEMICON China will be held at the New International Expo Centre, Shanghai, China, June 29 – July 1, 2023.