OVERVIEW of semiconductor manufacturing
To stay current in this constant changing industry, a deep understanding is required of the new methods of semiconductor manufacturing. After completing this course, the student will have a complete understanding of current semiconductor manufacturing processes. The course covers device operation, crystal growth and various types of substrates such as Si, SiGe, FDSOI, GaAs. Discuss various types of transistors such as pMOS, nMOS, Bipolar, BiCMOS, CMOS and FinFets. How circuit design impacts fabrication, mask making, wafer processing, assembly, packaging and final test are also covered. Additional topics include wafer processing steps such as mask generation, lithography, (including EUV), Deposition (CVD, electro-plating, ALD and sputtering), oxidation, diffusion, implant, RTP, etching, TSV and wafer probe.
What the Course Covers:
Who Should Attend:
Any one wanting an understanding of semiconductor manufacturing
Next Schedule Dates and Locations:
September 17-18, 2018/ Boston, MA ($1295 USD)
September 24-25, 2018/ Irvine, CA ($1295 USD)
October 1-2, 2018/ San Jose, CA ($1295 USD)
October 18-19, 2018/ Munich, Germany ($1295 USD)
November 8-9. 2018/ Hsinchu, Taiwan ($1295 USD)
November 29-30, 2018/ Orlando, FL ($1295 USD)
Price:$1295 USD per person (10% discount if 3 or more students attend the same event from the same company)
Also can be conducted at your company site for $12,900 USD for up to 20 students
To Register: Click here