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    TDK Showcases New Features of AFM 15 Flip Chip GGI Die Bonder at SEMICON West 2017

    TDK Showcases New Features of AFM 15 Flip Chip GGI Die Bonder at SEMICON West 2017
    • Updated AFM 15 for GGI flip chip back end assembly packaging allows for increased die size capability ~ 10 mm2, low energy die bonding and a clean lead-free process with high productivity.

    TDK Corporation will showcase the latest features of model AFM 15 Flip Chip Gold to Gold Interconnect Die Bonder at Booth 5228 in the North Hall at the SEMICON West Conference 2017, July 11-13, in the Moscone Center, San Francisco, Calif.

    The TDK AFM 15 uses flip chip ultrasonic gold to gold interconnect (GGI), an alternative die attachment process to gold wire bonding to decrease package factor form and improve electrical performance. The gold wire stitch is replaced by a gold stud bump using a gold stud bumping process tool. TDK GGI Flip Chip has reduced device package size by 70 percent compared to gold wire bonding die packages. Die sizes as small as 0.2 mm2 can be assembled using TDK model AFM 15 process.

    The TDK GGI flip chip model AFM 15 includes new horn capability for die sizes up to 10 mm2. TDK horn design provides linear X-Y nozzle movement over a wide range of ultrasonic power settings. Z-axis movement has been reduced by 90 percent during the GGI bonding process. TDK AFM 15 GGI die bonder process uses heating below 250 degrees Celsius. Bond force is optimized in the AFM 15 ten step bond profile menu. GGI process provides low bond stress to the die and a superior monolithic metallization interconnect.

    TDK GGI AFM 15 flip chip attachment process is a clean, lead-free, precision back end assembly process with low cost of ownership and high productivity. The TDK AFM 15 can be used for die interconnect assembly of ASIC, CMOS, MEMS and Opto devices.

    About TDK Corporation

    TDK Corporation is a leading electronics company based in Tokyo, Japan. It was established in 1935 to commercialize ferrite, a key material in electronic and magnetic products. TDK’s portfolio includes passive components, such as ceramic, aluminum electrolytic and film capacitors, ferrites and inductors, high-frequency products, and piezo and protection components, as well as sensors and sensor systems and power supplies. These products are marketed under the product brands TDK, EPCOS, InvenSense, Micronas, Tronics and TDK-Lambda. TDK’s further main product groups include magnetic application products, energy devices, and flash memory application devices. TDK focuses on demanding markets in the areas of information and communication technology and automotive, industrial and consumer electronics. The company has a network of design and manufacturing locations and sales offices in Asia, Europe, and in North and South America. In fiscal 2017, TDK posted total sales of USD 10.5 billion and employed about 100,000 people worldwide.


    TDK Corporation of America
    Ms. Sara M. Lambeth, +1-972-409-4519
    [email protected]
    Karbo Communications
    Ms. Kim Lianthamani, +1-415-255-6512
    [email protected]