Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, has received two prestigious EM Asia Innovation awards at Productronica China for its new products, 3D SPI TR7007 SII Ultra and 3D AOI TR7500QE Plus. The TR7007 SII Ultra won the SPI – SMT Inspection award, while the TR7500QE Plus won the Outstanding Product of the Year award.
The TR7007 SII Ultra is a 3D SPI that performs at an industry-leading speed of up to 180 cm2/s. The award-winning 3D SPI guarantees stability and precision during inspection, thanks to its enhanced mechanical platform. On the other hand, the 3D AOI TR7500QE Plus is the next-generation multi-camera side view platform equipped with innovative AI-powered algorithms and increased mechanical capabilities that offer high-accuracy inspection. The side view cameras allow the platform to inspect inner layer bridges, hidden lifted leads, and other out-of-sight defects. TRI’s cutting-edge solutions represent a significant step forward in TRI’s mechanical and optical technology advancements, which will ultimately help our customers maximize their productions’ potential.
TRI’s Smart Factory innovations aim to optimize SMT production through AI-powered Inspection, multiple 3D technologies, metrology inspection, real-time SPC trends, and M2M communications. TRI’s solutions comply with Industry 4.0 standards, such as the IPC-Hermes-9852, the IPC-DPMX, and the Connected Factory Exchange (IPC-CFX). Realize your production line’s potential with TRI’s Test and Inspection and Smart Factory Solutions to minimize downtime, optimize production quality, and reduce operator workload.