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    Tsinghua Unigroup To Build USD30 Billion Semiconductor Project In Nanjing

    Tsinghua Unigroup logo is seen at its office in Beijing, China, November 15, 2015. China's Tsinghua Unigroup Ltd plans to invest 300 billion yuan ($47 billion) over the next five years to build the world's third-biggest chipmaker, the chairman of the state-backed technology conglomerate said on Monday. Chairman Zhao Weiguo told Reuters in an interview that Tsinghua Unigroup, controlled by Beijing's elite Tsinghua University which counts President Xi Jinping among its alumni, was in talks with a U.S.-based company involved in the chip industry. Picture taken November 15, 2015. REUTERS/Kim Kyung-Hoon

    China’s Tsinghua Unigroup announced on its official website that the group plans to invest CNY260 billion to build a semiconductor industrial base and its new IT investment and R&D headquarters project in Nanjing, Jiangsu province.

    Of the total investment, about USD30 billion will be allocated to the semiconductor industrial base, which will mainly produce 3D-NAND flash and DRAM memory chips.

    Tsinghua Unigroup said that the first phase of this semiconductor project will have USD10 billion investment and it expects to make 100,000 chips on a monthly basis. The establishment of this project will strongly support China’s development in the mainstream memory sector.

    Apart from the chip project, Tsinghua Unigroup will invest about CNY30 billion to build a supporting IC international city, including technology park, design and packaging industrial base, international school, commercial facilities, and international talent apartments.