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    Unveiling Excellence: ViTrox Sets to Showcase Innovation at the 2024 SMTA Wafer-Level Packaging Symposium

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    ViTrox, which aims to be the World’s Most Trusted Technology Company, is pleased to announce its participation in the 2024 SMTA Wafer-Level Packaging Symposium at tabletop #1 in the Hyatt Regency San Francisco Airport from 13th to 14th February 2024.

    ViTrox is set to showcase its latest technological advancements, highlighting its dedication to meeting the evolving needs of the industries. The cutting-edge solutions to be unveiled during the show range from PX730i Die Sorting, Inspection & Package Solution, Wi8i Wafer Vision Inspection Handler, SMT PCBA Vision Inspection Solutions (SPI, AOI, AXI, ARV), and the Industry 4.0 Manufacturing Intelligence Solutions (V-ONE).

    ViTrox’s PX730i is an advanced solution tailored for die sorting, comprehensive 6-sided inspection, and efficient tape & reel packaging. Specifically designed to supersede traditional human visual inspection methods, this system boasts a high-speed waffle-to-tape and reel inspection capability and a high-accuracy vision inspection system to ensure optimal efficiency and accuracy in manufacturing. Additionally, Wi8i Wafer Vision Inspection Handler is designed to support 2D surface defect inspections and metrology for a variety of wafer forms, including raw wafers, hoop ring wafers, and framed wafers, ranging from 100 mm (4″) to 300 mm (12″). The wafer vision inspection handler has various handling mechanisms to replace conventional manual visual inspection while offering reliable, repeatable, reproducible inspection results.

    The V310i 3D SPI provides effortless programming while achieving excellent repeatability and accurate inspection results. Equipped with Ultra Smart Programming, users can instantly start inspection without manual parameter setup, making it user-friendly even for inexperienced operators. Next will be the V510i 3D AOI solution, which is well-implemented with in-depth Artificial Intelligence (A.I.) Smart Technologies. With A.I. Smart Programming, our AOI can reduce human dependency, rapidly improve the programming speed, and guarantee quality, accuracy, and consistency during inspections. Additionally, by incorporating new machine geometry and scanning methods, V810i 3D AXI boosts inspection speed by up to 30%. Equipped with A.I. integration, our AXI possesses the capability to detect defects of specific joint types with enhanced inspection accuracy.

    Our award-winning V9i Advanced Robotic Vision (ARV) Solution revolutionizes flexible inspections for conformal coating and final assembly inspections. With its Advanced Smart Learning Algorithm, V9i ARV detects various conformal coating defects and checks for screw, cosmetic, connector, and label defects in final assembly without requiring CAD information. Last but not least, our cutting-edge Industry 4.0 Manufacturing Intelligence Solutions – V-ONE, a Smart Manufacturing ensures connectivity within the production line, accurate data analytics visualization and adept reactivity in Machine-2-Machine (M2M) production.

    “We are thrilled to share our latest inspection solutions during the show. ViTrox’s cutting-edge technologies represent our commitment to delivering the highest standards of quality and productivity to our customers,” said Richard Osborne, Sr. General Manager of the U.S. and Canada.

    Take advantage of this opportunity to meet and network with us at the SMTA Wafer-Level Packaging Symposium by scheduling an appointment with us,or contact us today at [email protected] to find out more.