Webinars and Programs

Global SMT TV – Broadcasting Schedule

All events are broadcast at: 7:30am PCT, 10:30am EST, 3:30pm GMT and 4:30pm CET

** All programs will be broadcast on https://zoom.us

February 8th - Cleanliness of PC assemblies and SIR testing techniques

Cleanliness of PC assemblies and SIR testing techniques

Ensuring cleanliness consistency and the dependability of SIR testing results relies on a variety of factors including the substrate material, test coupon design, paste and coating used etc. This panel will discuss how to setup and optimize SIR test coupons to achieve accurate and repeatable results.

February 22nd - Electrically Conductive Adhesives (ECAs) applications and alternatives

Electrically Conductive Adhesives (ECAs) applications and alternatives

The applications for ECA’s as an alternative to low-temperature solders continues to rise as the number of heat-sensitive devices rises with new applications. This panel will discuss the advantages, disadvantages and use-cases for using ECAs in electronics assembly.

March 8th - Component sourcing and supply chain visibility

Component sourcing and supply chain visibility

As the chip shortage starts to ease later in the year, what are the lessons learned from the recent supply chain shortage and how should OEMs and manufacturers be better-placed to manage these shocks in the future? This will panel will discuss the current status and the future trends and challenges.

March 22nd - Digital Twin and establishing a Design for Manufacturing (DFM) strategy

Digital Twin and establishing a Design for Manufacturing (DFM) strategy

The use of digital twin as a tool to digitally map your board design, materials and processes helps reduce design turns and the time for NPI to reach production. This panel will discuss tips on how to optimize the process using digital twins.

April 5th - ESD challenges and strategies - what you need to know

ESD challenges and strategies – what you need to know

ESD can cause serious damage to sensitive components on board assemblies, if not carefully manages. This panel will discuss best practice for establishing an ESD strategy in your factroy.

April 19th - Head-inPillow - what causes it, how do you spot it and how do you avoid it?

Head-inPillow – what causes it, how do you spot it and how do you avoid it?

Traditionally head-in-pillow (HiP) is one of the most difficult defects to detect, This panel will look at symptoms, causes and cures.

June 7th - Attracting talent - what are the key skills needed by modern manufacturers?

Attracting talent – what are the key skills needed by modern manufacturers?

As factories modernise and automate, SMT operators need to upskill to manage the increasingly data driven environment. This panel of HR experts discuss the challenges of sourcing and hiring the right talent.

June 21st - Charting an IPC roadmap for your "Factory of the Future"

Charting an IPC roadmap for your “Factory of the Future”

Large tier one companies are ahead in strategizing for Factory of the Future, but what can small to mid-sized companies learn from them?

September 13th - Using X-ray in an EMS production enviroment

Using X-ray in an EMS production enviroment

The increasing miniaturization and use of BGAs has made x-ray a “must-have” in any modern EMS factory. This panel will discuss the options and benefits of inline versus at-line x-ray inspection.

September 27th - Test standards, systems and criteria for EV applications

Test standards, systems and criteria for EV applications

As EV systems evolve, a range of standards, systems and criteria for maintaining reliability in harsh environments are being developed. This panel will discuss the current and future test landscape for EV.

October 5th - Thermal management in confined spaces

Thermal management in confined spaces

Continued miniaturisation is increasing the challenges for designers and manufacturers to manage thermal loads within assemblies. This panel will discuss materials and methodologies to mitigate these challenges.

October 12th - Eliminating counterfeits from your supply chain

Eliminating counterfeits from your supply chain

Counterfeit components have proliferated through the Covid pandemic and have become ever-more sophisticated. This panel will discuss a range of counterfeit detection and avoidance techniques.

November 9th - Printing versus jetting and other forms of dispensing systems

Printing versus jetting and other forms of dispensing systems

Stencil printing is still the preferred method for depositing high volume solder paste on PCBs. However, jetting systems are becoming increasingly capable and in many cases offer a real alternative. This panel discusses the pros and cons.

November 30th - High reliability in harsh environments

High reliability in harsh environments

As electronics manufacturing expands into new applications, an increasing number of harsh environment applications ranging from EV to Down-hole and Aerospace. This panel will discuss materials and strategies to protect electronics assemblies in these conditions.

December 7th - Should OEMs taking manufacturing back in-house?

Should OEMs taking manufacturing back in-house?

IP protection and lack of supply chain and manufacturing visibility are driving OEMs to reconsider their outsourcing strategies, especially given the efforts to be more sustainable and reduce the length of their supply chain and carbon footprint. Is it time to reverse this process?

December 14th - Storage solutions, counting systems and AIVs - how to optimize production flow

Storage solutions, counting systems and AIVs – how to optimize production flow

If you don’t know what you have and where it is located, you cannot achieve JIT manufacturing and you lack the flexibility to handle a volatile supply chain. This panel discusses the biggest revolution in materials handling in recent years.

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