Cleanliness of PC assemblies and SIR testing techniquesEnsuring cleanliness consistency and the dependability of SIR testing results relies on a variety of factors including the substrate material, test coupon design, paste and coating used etc. This panel will discuss how to setup and optimize SIR test coupons to achieve accurate and repeatable results.
Electrically Conductive Adhesives (ECAs) applications and alternativesThe applications for ECA’s as an alternative to low-temperature solders continues to rise as the number of heat-sensitive devices rises with new applications. This panel will discuss the advantages, disadvantages and use-cases for using ECAs in electronics assembly.
Component sourcing and supply chain visibility
As the chip shortage starts to ease later in the year, what are the lessons learned from the recent supply chain shortage and how should OEMs and manufacturers be better-placed to manage these shocks in the future? This will panel will discuss the current status and the future trends and challenges.
Digital Twin and establishing a Design for Manufacturing (DFM) strategy
The use of digital twin as a tool to digitally map your board design, materials and processes helps reduce design turns and the time for NPI to reach production. This panel will discuss tips on how to optimize the process using digital twins.