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    ZESTRON South Asia releases whitepaper “Critical Cleaning Requirements To Overcome Advanced Packaging Defluxing Challenges”

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    ZESTRON, the global leading provider of high precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is pleased to release the whitepaper “Critical Cleaning Requirements To Overcome Advanced Packaging Defluxing Challenges”

    Whitepaper Abstract:

    As technology advances, wafer-level packages have emerged in many different varieties. Computing
    has evolved significantly over the years. Chips integrated with additional functionalities to improve
    performance, processing challenges, storage and networking has become standard. The
    development of the packages such as SiP, fcBGA, PoP, 2.5D, etc. which utilizes multiple or larger die
    sizes, increased bump counts, lower standoff height and a large variety of components on the
    packages have reduced the effectiveness of cleaning. The common packaging interconnect is using
    solder and die attached to a substrate by a solder reflow process. The flux residues after soldering
    pose a cleaning challenge, especially underneath these extremely low-profile components. As
    standoff height reduces, flux residues have less area to outgas during reflow. Typically, the standoff
    height is <100µm and it continues to shrink further. For some components such as QFNs, LGAs, the
    large thermal pad at the center of the component body poses barriers to the complete removal of
    the flux residues. Partially removed or untouched residues can lead to reliability failures as
    consequences of electrochemical migration and dendrite growth as well as electrical leakage
    currents. Effective cleaning improves product reliability by ensuring optimal condition for subsequent
    processes, such as wire bonding, underfill and molding. This paper discusses the breakthrough in
    cleaning challenges for advanced packaging, especially when addressing factors like high density
    assemblies, latest flux formulation and low standoff heights. The most common cleaning system used
    for cleaning advanced packaging substrate is a conveyorized spray-in-air inline cleaning system. The
    discussion extends to how effectively the cleaning process needs to be balanced, in terms of
    chemical, mechanical and thermal energies. We will also explore the key cleaning parameters that
    lead to successful removal of flux residues from underneath the low-profile components. For
    example: nozzle types, spray pressure, chemical exposure time, cleaning temperature and type of
    cleaning agent. We will conclude with several customer case studies to validate the above findings.

    To request for this free whitepaper, please click the link here: Request free whitepaper

    For more information about Zestron, please email us at infoasia@zestron.com