Zestron South Asia is pleased to announce that it will host “Impact Of High Peak Reflow Temperature On Flux Remocal Of High Pb Solder Paste” free webinar on 8 th September 2023, Friday from 3:00 PM to 3:45 PM (MYS Time, GMT +8). This is the 3rd instalment of the ZESTRON Academy 2023 Cleaning Webinar Series, and will be presented by our industry expert, Mr. Guan Tatt Yeoh, Senior Application Engineer at ZESTRON South Asia.
High power discrete packages such as MOSFET, smart power ASICs, IGBTs modules and integrated power modules, commonly used high Pb solder paste as die attach and interconnect material. The most common high Pb die attached materials are Pb92.5Sn5Ag2.5 and Pb95Sn5 which have a liquidus temperature of >300°C. Void, caused by lack of solder or poor wetting in the solder bonds, can be a serious problem for power devices. Usually process engineers increase the soldering profile peak temperature in order to reduce the voids. However, this leads to an increase in the flux activity during the reflow soldering process. This webinar shares the study about the impact of different peak reflow temperatures on cleaning effectiveness of discrete packages.
To register for this webinar, please click: Register for free webinar